High-efficiency photo-electron conversion devices |
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High-efficiency photo-electron conversion devices Semiconductor processes and nanofabrication Characterizations and applications of nanomaterials Optical characterization of graphene Graphene-gold oxide photodetector Optical analysis of hollow gold nanoparticles Photomodification of hollow gold nanoparticles for high-density data storage Light harvesting and light extraction Light extraction efficiency of LEDs Antireflection structures for solar cells Optical analysis techniques Eco-friendly devices and sensors
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Silicon-based broadband antenna for high responsivity and polarization-insensitive photodetection at telecommunication wavelengths Although the concept of using local surface plasmon resonance based nanoantenna for photodetection well below the semiconductor band edge has been demonstrated previously, the nature of local surface plasmon resonance based devices cannot meet many requirements of photodetection applications. Here we propose the concept of deep-trench/thinmetal (DTTM) active antenna that take advantage of surface plasmon resonance phenomena, three-dimensional cavity effects, and large-area metal/semiconductor junctions to effectively generate and collect hot electrons arising from plasmon decay and, thereby, increase photocurrent. The DTTM-based devices exhibited superior photoelectron conversion ability and high degrees of detection linearity under infrared light of both low and high intensity. Therefore, these DTTM-based devices have the attractive properties of high responsivity, extremely low power consumption, and polarization-insensitive detection over a broad bandwidth, suggesting great potential for use in photodetection and on-chip Si photonics in many applications of telecommunication fields. |
A plasmonic device possessing the DTTM active antenna structure for photodetection well below the semiconductor band edge. (a) Energy band diagram for plasmonically driven ‘hot’ electrons over a metal–semiconductor Schottky barrier. (b) Schematic representation of the electrical measurement set-up and proposed DTTM active antenna structure on a Si-based device. (c) Top-view and cross-sectional scanning electron microscopy images of DTTM structures on Si substrates.
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